BAT93 - Silicon Epitaxial Schottky Barrier Diode

Overview

The BAT93 is a high-performance silicon epitaxial Schottky barrier diode designed for ultra-fast switching applications. This component is optimized for low forward voltage drop and high-speed operation, making it ideal for use in power management, RF circuits, and high-frequency rectification. The BAT93 is housed in a compact two-pin surface-mount device (SMD) package, ensuring ease of integration into modern PCB designs while maintaining excellent thermal and electrical performance.

Features

• Ultra-Fast Switching Speed: The Schottky barrier construction enables rapid transition between conducting and non-conducting states, minimizing switching losses.
• Low Forward Voltage: Typically 0.45V at 1A, reducing power dissipation and improving efficiency in power-sensitive applications.
• High Temperature Stability: Maintains consistent performance across a wide operating temperature range.
• Low Reverse Leakage Current: Minimizes power loss in blocking state.
• Compact SMD Package: Two-pin surface-mount design (SOD-323) saves board space and enables automated assembly.
• RoHS Compliant: Meets environmental standards for lead-free manufacturing.

Applications

The BAT93's unique combination of characteristics makes it suitable for a wide range of applications:

• Power Supply Circuits: Used as freewheeling diodes in switch-mode power supplies (SMPS)
• High-Frequency Rectification: Ideal for RF detection and mixer circuits
• Voltage Clamping: Protection circuits against voltage spikes and transients
• Reverse Polarity Protection: Prevents damage from incorrect power supply connections
• DC-DC Converters: Synchronous rectification in buck and boost converters
• Signal Demodulation: RF and microwave signal processing
• High-Speed Switching Circuits: Digital logic interfaces and pulse circuits

Electrical Characteristics

(All values typical at 25°C unless otherwise specified)

Absolute Maximum Ratings

• Peak Repetitive Reverse Voltage (VRRM): 30V
• Average Forward Current (IF(AV)): 200mA
• Peak Forward Surge Current (IFSM): 1A (pulse width = 1μs)
• Junction Temperature (Tj): -65°C to +125°C
• Storage Temperature (Tstg): -65°C to +150°C

Forward Characteristics

• Forward Voltage (VF): 0.45V @ IF = 1mA
• Forward Voltage (VF): 0.55V @ IF = 10mA
• Forward Voltage (VF): 0.75V @ IF = 100mA

Reverse Characteristics

• Reverse Leakage Current (IR): 0.5μA @ VR = 10V
• Reverse Leakage Current (IR): 10μA @ VR = 10V, Tj = 125°C
• Junction Capacitance (Cj): 2pF @ VR = 0V, f = 1MHz

Dynamic Characteristics

• Reverse Recovery Time (trr): 4ns (typical)
• Forward Recovery Time (tfr): Negligible

Package Information

SOD-323 (SC-76) Package Dimensions

• Package Type: Surface Mount Device (SMD)
• Dimensions: 1.7mm x 1.25mm x 0.95mm (L x W x H)
• Lead Pitch: 1.0mm
• Termination: Matte tin-plated leads
• Weight: Approximately 5mg
• Moisture Sensitivity Level (MSL): Level 1 (unlimited floor life at ≤30°C/85%RH)

Recommended PCB Land Pattern

• Pad Width: 0.6mm minimum
• Pad Length: 0.8mm minimum
• Pad Spacing: 0.8mm between pad edges
• Soldering: Compatible with reflow and wave soldering processes

Thermal Characteristics

• Thermal Resistance, Junction to Ambient (RθJA): 500°C/W
• Thermal Resistance, Junction to Lead (RθJL): 300°C/W
• Maximum Power Dissipation (PD): 250mW @ 25°C ambient temperature

Reliability and Qualification

• ESD Rating: Human Body Model (HBM) Class 1C (>1kV)
• Flammability Rating: UL 94 V-0 compliant
• Qualification: AEC-Q101 qualified for automotive applications
• MTTF: >1,000,000 hours at rated operating conditions

Handling and Storage Recommendations

• Store in dry, inert environment (≤40°C, ≤90%RH)
• Use ESD precautions during handling
• Follow J-STD-020 moisture sensitivity guidelines
• Recommended solder profile per IPC/JEDEC J-STD-020

Ordering Information

• Standard Packaging: Tape and reel (3,000 pieces per reel)
• Part Number Format: BAT93-xxx (where xxx indicates packaging options)
• Lead Time: Standard products typically available from stock