BYG80 - High-Efficiency Rectifier Diode

Overview

The BYG80 is a high-performance rectifier diode designed for surface-mount applications. This glass-passivated component offers excellent reliability and efficiency in a compact DO-214AC (SMA) package. With its robust construction and optimized electrical characteristics, the BYG80 is ideal for demanding power conversion and rectification applications.

Key Features

• Glass passivated junction for enhanced reliability
• High maximum operating temperature range
• Low forward voltage drop for improved efficiency
• Fast switching capability
• Surge current protection
• Lead-free and RoHS compliant construction
• Surface-mountable DO-214AC (SMA) package

Applications

The BYG80 is suitable for a wide range of applications including:

• Switch-mode power supplies (SMPS)
• DC-DC converters
• Reverse polarity protection circuits
• Freewheeling diodes
• Battery charging circuits
• Power factor correction circuits
• Industrial power systems
• Automotive electronics

Electrical Characteristics

Absolute Maximum Ratings

• Maximum repetitive peak reverse voltage: 800V
• Maximum RMS voltage: 560V
• Maximum DC blocking voltage: 800V
• Maximum average forward current: 1A
• Peak forward surge current (8.3ms single half sine-wave): 30A
• Operating junction temperature range: -55°C to +150°C
• Storage temperature range: -55°C to +150°C

Thermal Characteristics

• Thermal resistance, junction to ambient: 75°C/W
• Thermal resistance, junction to lead: 25°C/W

Electrical Properties (at Tj=25°C unless otherwise specified)

• Forward voltage (IF=1A): 1.1V typical, 1.3V maximum
• Reverse current (VR=800V): 5μA maximum
• Reverse recovery time (IF=1A, IR=1A): 500ns maximum
• Junction capacitance (VR=4V, f=1MHz): 15pF typical

Package Information

DO-214AC (SMA) Package Dimensions

• Package length: 4.3mm ±0.2mm
• Package width: 2.6mm ±0.2mm
• Package height: 1.9mm ±0.1mm
• Terminal width: 1.25mm ±0.1mm
• Terminal length: 0.7mm ±0.1mm

Marking Information

The device is marked with "BYG80" followed by a date code for traceability. The cathode end is marked with a band.

Mounting Information

• Recommended pad layout according to IPC-7351 standards
• Maximum soldering temperature: 260°C for 10 seconds
• Recommended reflow profile per J-STD-020

Reliability Data

• Moisture sensitivity level (MSL): 1 (unlimited floor life)
• ESD rating: Class 1B (Human Body Model)
• Flammability rating: UL 94 V-0
• Qualification testing performed per JEDEC standards

Performance Characteristics

Forward Voltage vs. Forward Current

The forward voltage characteristic shows a typical value of 1.1V at 1A, with a positive temperature coefficient that provides natural current sharing when devices are paralleled.

Reverse Leakage Current vs. Temperature

The reverse leakage current remains below 5μA at maximum rated voltage up to the maximum operating temperature, ensuring reliable blocking performance.

Switching Characteristics

The BYG80 features optimized switching characteristics with a maximum reverse recovery time of 500ns, making it suitable for high-frequency switching applications up to 100kHz.

Design Considerations

Thermal Management

Proper thermal management is essential for reliable operation. The following guidelines should be observed:

• Use adequate copper area for heat dissipation
• Consider thermal vias for multilayer boards
• Monitor junction temperature in high ambient conditions

PCB Layout Recommendations

• Minimize loop area between diode and associated components
• Provide sufficient clearance for high voltage operation
• Use thick copper traces for high current paths

Quality and Compliance

• Manufactured in ISO 9001 certified facilities
• RoHS compliant and lead-free
• Halogen-free option available
• PPAP capability available upon request

Ordering Information

The BYG80 is available in tape and reel packaging for automated assembly:

• Standard packaging: 3,000 pieces per 13" reel
• Custom packaging options available