HB52F169

HB52F169E1 16M x 72-Bit Synchronous Dynamic RAM Registered Module

Overview

The HB52F169E1 is a high-performance 8-byte DIMM (Dual In-line Memory Module) designed as an optimized main memory solution for 8-byte processor applications. This module integrates 18 pieces of 64-Mbit SDRAM (HM5264405FTT) in TSOP packages, along with a PLL clock driver, register drivers, and a serial EEPROM for Presence Detect (PD). The module is built as a 168-pin socket-type package with dual lead-out, enabling high-density mounting without requiring surface-mount technology. The HB52F169E1 is fully compliant with JEDEC standards and provides a reliable, high-speed memory solution for demanding computing environments.

Features

• Compatibility: Fully compliant with JEDEC standard outline for 8-byte DIMM modules.
• Package: 168-pin socket type (dual lead-out) with dimensions of 133.35 mm (Length) × 43.18 mm (Height) × 4.00 mm (Thickness) and a lead pitch of 1.27 mm.
• Power Supply: Operates at 3.3 V, ensuring compatibility with standard LVTTL interfaces.
• Clock Frequency: Supports up to 133 MHz for high-speed data processing.
• Data Bus Width: ×72 ECC (Error-Correcting Code) for enhanced data integrity.
• Memory Organization: Single pulsed RAS (Row Address Strobe) with 4 independently operable banks.
• Burst Operations: Supports burst read/write and burst read/single write operations.
• Programmable Burst Length: Configurable as 1, 2, 4, 8, or full page.
• Burst Sequence: Supports both sequential and interleave modes.
• CAS Latency: Programmable to 4 cycles at 133 MHz.
• Decoupling Capacitors: Mounted beside each TSOP on the module board for improved signal integrity.

Applications

The HB52F169E1 is designed for high-performance computing systems where reliability and speed are critical. Key application areas include:

• Enterprise Servers: Provides robust memory support for data centers and server farms.
• Workstations: Enhances performance in engineering, scientific, and multimedia workstations.
• High-Performance Computing (HPC): Suitable for applications requiring large memory bandwidth and low latency.
• Networking Equipment: Used in routers, switches, and other network infrastructure requiring high-speed memory.
• Embedded Systems: Ideal for industrial and military applications where reliability is paramount.

Electrical Characteristics

The HB52F169E1 operates under the following electrical specifications:

• Supply Voltage (V_DD): 3.3 V ± 0.3 V
• Operating Frequency: Up to 133 MHz
• Interface: LVTTL-compatible inputs and outputs
• Power Consumption: Optimized for low power while maintaining high performance (exact values depend on operational mode and frequency)
• Refresh Rate: Auto-refresh and self-refresh modes supported
• Operating Temperature: Commercial (0°C to +70°C) or Industrial (-40°C to +85°C) ranges available

Package Information

The HB52F169E1 is housed in a 168-pin socket-type package with the following mechanical specifications:

• Dimensions: 133.35 mm (Length) × 43.18 mm (Height) × 4.00 mm (Thickness)
• Lead Pitch: 1.27 mm
• Mounting Style: Socket-type, dual lead-out for easy installation and replacement
• Weight: Approximately [insert weight if available] grams
• Material: High-quality PCB with decoupling capacitors for noise reduction

Additional Notes

The HB52F169E1 includes a 2-kbit serial EEPROM for Presence Detect (PD), which allows the system to automatically identify the module's characteristics. The module's design ensures compatibility with standard DIMM sockets, making it a versatile choice for system integrators. The inclusion of ECC support enhances data reliability, making it suitable for mission-critical applications.

For detailed timing diagrams, signal descriptions, and further technical specifications, refer to the official datasheet or contact the manufacturer.