HB52RD328DC 16M × 64 × 2 Banks Synchronous DRAM SODIMM Technical Summary

Overview

The HB52RD328DC is a high-performance 16M × 64 × 2 banks Synchronous Dynamic RAM (SDRAM) module packaged in a Small Outline Dual In-line Memory Module (SODIMM) form factor. This module integrates 32 pieces of 64-Mbit SDRAM (HM5264405FTB) in TCP (Tape Carrier Package) along with a 2-kbit serial EEPROM for Presence Detect (PD) functionality. Designed for high-density mounting applications, this module features a compact 144-pin Zig Zag Dual Tabs socket type package that eliminates the need for surface mount technology while maintaining excellent electrical performance.

The module operates at 3.3V and supports clock frequencies up to 100 MHz, making it suitable for high-speed memory applications. With its LVTTL interface and ×64 non-parity data bus width, it provides efficient data transfer capabilities for demanding computing environments.

Features

• Form Factor: 144-pin Zig Zag Dual tabs socket type (dual lead out)
• Dimensions: 67.60 mm (Length) × 31.75 mm (Height) × 3.80 mm (Thickness)
• Lead Pitch: 0.80 mm
• Power Supply: 3.3 V ± 0.3V
• Clock Frequency: Up to 100 MHz
• Interface: LVTTL compatible
• Data Bus Width: ×64 Non-parity
• Bank Architecture: 4 banks operating simultaneously and independently
• Burst Operations: Supports burst read/write and burst read/single write operations
• Programmable Burst Length: 1, 2, 4, 8, or full page (sequential or interleave)
• CAS Latency: Programmable 2/3 or fixed 3 depending on variant
• Refresh Cycles: 4096 refresh cycles/64ms with auto refresh and self refresh options
• Low Power: Special L-versions available with reduced self refresh current
• Compatibility: Fully compliant with JEDEC standard outline 8-byte SODIMM specifications

Applications

The HB52RD328DC is designed for use in a variety of computing and embedded systems requiring high-density, high-performance memory solutions:

• Notebook and laptop computers
• Embedded computing systems
• Industrial control systems
• Telecommunications equipment
• Medical instrumentation
• Automotive computing systems
• High-performance gaming consoles
• Network servers and storage systems

Electrical Characteristics

Absolute Maximum Ratings

• Supply Voltage (VDD): -0.5V to +4.6V
• Input Voltage (VI): -0.5V to VDD + 0.5V
• Output Voltage (VO): -0.5V to VDD + 0.5V
• Operating Temperature: 0°C to +70°C (commercial), -40°C to +85°C (industrial)
• Storage Temperature: -55°C to +125°C

Recommended Operating Conditions

• Supply Voltage (VDD): 3.3V ± 0.3V
• Input High Voltage (VIH): 2.0V min
• Input Low Voltage (VIL): 0.8V max
• Operating Temperature: 0°C to +70°C (standard), -40°C to +85°C (extended)

DC Characteristics

• Input Leakage Current: ±1 μA max
• Output Leakage Current: ±1 μA max
• Operating Current (Active): 400 mA max @ 100 MHz
• Standby Current: 5 mA max
• Self Refresh Current: 2 mA max (L-version)

AC Characteristics

• Clock Cycle Time: 10 ns min (100 MHz)
• Access Time from Clock: 5.4 ns max
• CAS Latency: 2 or 3 clock cycles
• RAS to CAS Delay: 20 ns min
• Row Precharge Time: 20 ns min
• Refresh Period: 64 ms max

Package Information

Physical Dimensions

• Module Length: 67.60 mm
• Module Height: 31.75 mm
• Module Thickness: 3.80 mm
• Pin Count: 144 pins
• Pin Pitch: 0.80 mm
• Package Type: Zig Zag Dual Tabs Socket Type

Pin Configuration

The HB52RD328DC features a 144-pin configuration with dual-row zig-zag pin arrangement for high-density connections. The pinout includes:

• Power and ground pins for stable operation
• Address inputs for row and column addressing
• Data I/O pins for 64-bit data bus
• Control signals (RAS, CAS, WE, CS)
• Clock inputs for synchronous operation
• Byte mask controls (DQMB)
• Presence Detect interface

Ordering Information

Mounting and Handling

The HB52RD328DC is designed for easy installation in standard SODIMM sockets. Special care should be taken to:

• Align the module correctly with the