10 50GS - Monolithic Temperature and Power DMOS Component

Overview

The 10 50GS is a highly integrated monolithic component combining temperature sensing and power DMOS output stage functionality. This device is designed for applications requiring precise temperature monitoring and robust power switching capabilities. The integration of these features into a single package makes the 10 50GS an ideal solution for space-constrained designs while improving system reliability.

With its vertical power DMOS output stage, the component offers excellent power handling characteristics while maintaining compact dimensions. The built-in temperature sensing capability provides real-time thermal monitoring, enabling protection mechanisms and system optimization based on thermal conditions.

Features

• Integrated Temperature Sensing: Monolithic temperature measurement capability with high accuracy
• Vertical Power DMOS Output Stage: Robust power handling with efficient switching characteristics
• Low On-State Resistance: Minimizes power loss and improves efficiency in switching applications
• Comprehensive Protection Features: Built-in overload protection safeguards the device and system
• Thermal Management: Integrated temperature monitoring enables proactive thermal management
• Compact Design: Monolithic integration reduces board space requirements
• High Reliability: Designed for demanding industrial applications

Applications

The 10 50GS is suitable for a wide range of applications requiring combined power switching and temperature monitoring:

Industrial Systems

• Motor control systems
• Power supply monitoring and protection
• Industrial automation equipment
• Heating element control

Automotive Electronics

• Engine management systems
• Battery management and protection
• Power distribution modules

Consumer Electronics

• Smart home devices
• Power management in appliances
• Temperature-controlled systems

Power Management

• DC-DC converters
• Load switches
• Power distribution systems

Electrical Characteristics

Absolute Maximum Ratings

• Supply Voltage: 40V
• Output Current (Continuous): 10A
• Output Current (Peak): 50A
• Operating Temperature Range: -40°C to +150°C
• Storage Temperature Range: -55°C to +175°C
• Junction Temperature: 175°C maximum

Thermal Characteristics

• Thermal Resistance (Junction-to-Case): 1.5°C/W
• Thermal Resistance (Junction-to-Ambient): 40°C/W
• Temperature Measurement Accuracy: ±1.5°C (typical)

Switching Characteristics

• On-State Resistance (R_DS(on)): 50mΩ maximum at 25°C
• Turn-On Time: 100ns typical
• Turn-Off Time: 150ns typical
• Gate Threshold Voltage: 2V to 4V

Protection Features

• Overcurrent Protection Threshold: Adjustable (typical range 15A-45A)
• Thermal Shutdown Threshold: 150°C (typical)
• Undervoltage Lockout: 8V (typical)

Package Information

Physical Dimensions

The 10 50GS is available in a compact, thermally enhanced package:

• Package Type: TO-263-7L (D2PAK)
• Dimensions: 10.0mm x 9.25mm x 4.5mm
• Lead Pitch: 1.27mm
• Mounting Style: Surface Mount
• Weight: 2.0g typical

Pin Configuration

• Pin 1: Temperature Sensor Output
• Pin 2: Gate Control Input
• Pin 3: Power Supply Input
• Pin 4: Ground
• Pin 5: Drain Connection (Power Output)
• Pin 6: Current Sense Output
• Pin 7: Protection Circuit Enable

Thermal Considerations

The package features an exposed thermal pad to facilitate heat dissipation. For optimal thermal performance:

• Use appropriate thermal vias when designing the PCB layout
• Ensure proper solder coverage on the thermal pad
• Consider additional heatsinking for high current applications
• Maintain adequate clearance from other heat-generating components

Design Considerations

Layout Guidelines

• Keep high-current traces as short and wide as possible
• Use a star grounding configuration for optimal noise performance
• Place decoupling capacitors close to the power pins
• Ensure proper thermal relief patterns for the thermal pad

Thermal Management

To maximize performance and reliability:

• Monitor the temperature output to implement appropriate thermal throttling
• Consider airflow in the system design for convective cooling
• Use thermal interface materials when attaching additional heatsinks
• Derate current handling capability at elevated temperatures

Protection Circuit Implementation

• Configure the protection enable pin according to application requirements
• Use the current sense output for precise current monitoring
• Implement appropriate filtering on the temperature output for noise immunity
• Consider adding external protection components for harsh environments

Ordering Information

The 10 50GS is available in several variants to suit different application requirements:

• 10 50GS-1: Standard version with basic protection features
• 10 50GS-2: Enhanced version with adjustable current limit
• 10 50GS-T: Tape and reel packaging for automated assembly