04 50L Technical Summary

Overview

The 04 50L is a highly efficient monolithic integrated circuit designed for temperature sensing and power management applications. This component combines a vertical power DMOS output stage with advanced logic and protection features, making it suitable for demanding industrial and automotive environments. With its low on-state resistance and separate logic supply pin, the 04 50L offers superior performance in power switching applications while maintaining excellent thermal characteristics.

Features

• Monolithic temperature sensing capability with integrated protection
• Vertical power DMOS output stage for efficient power handling
• Exceptionally low on-state resistance (R_DS(on))
• Dedicated logic and protection supply pin for improved noise immunity
• Low operating supply current for energy-efficient operation
• Comprehensive overload protection features including:
  • Overcurrent protection
  • Thermal shutdown
  • Undervoltage lockout
• Wide operating temperature range (-40°C to +150°C)
• Fast switching capability for PWM applications

Applications

The 04 50L is designed for a wide range of power management and temperature monitoring applications, including:

• Automotive systems:
  • Electronic power steering
  • Transmission control modules
  • Engine management systems
• Industrial automation:
  • Motor drivers
  • Power supplies
  • PLC output stages
• Consumer electronics:
  • Smart home devices
  • Power tools
  • Battery management systems
• Telecommunications equipment power distribution

Electrical Characteristics

Absolute Maximum Ratings

• Supply Voltage (V_DD): 40V
• Logic Supply Voltage (V_LOGIC): 7V
• Output Current (I_OUT): 5A continuous, 10A peak
• Power Dissipation (P_D): 2.5W @ 25°C
• Operating Junction Temperature: -40°C to +150°C
• Storage Temperature: -55°C to +175°C

Typical Operating Characteristics

• On-State Resistance (R_DS(on)): 50mΩ @ V_GS = 10V, I_D = 5A
• Gate Threshold Voltage (V_GS(th)): 2.0V to 3.0V
• Quiescent Current (I_DD): 1.5mA typical
• Logic Supply Current (I_LOGIC): 0.5mA typical
• Turn-On Delay Time (t_d(on)): 15ns typical
• Turn-Off Delay Time (t_d(off)): 25ns typical
• Overcurrent Protection Threshold: 6.5A ±0.5A
• Thermal Shutdown Threshold: 160°C with 15°C hysteresis

Package Information

Physical Dimensions

The 04 50L is available in a compact, thermally enhanced PowerSO-10 package with the following dimensions:

• Package Type: PowerSO-10 (Exposed Pad)
• Overall Length: 9.9mm ±0.2mm
• Overall Width: 7.5mm ±0.2mm
• Overall Height: 2.35mm max
• Lead Pitch: 1.27mm
• Exposed Pad Dimensions: 4.5mm × 3.5mm

Package Marking

• Top Marking: "04 50L" followed by date code
• Pin 1 Indicator: Dot marking near pin 1
• RoHS Compliance: Lead-free and halogen-free

Thermal Characteristics

• Junction-to-Ambient Thermal Resistance (R_θJA): 40°C/W
• Junction-to-Case Thermal Resistance (R_θJC): 3°C/W
• Maximum Recommended Operating Junction Temperature: 150°C

Functional Description

The 04 50L integrates a high-performance power DMOS transistor with advanced control and protection circuitry. The separate logic supply pin allows for clean power to the control circuitry while the main power stage handles higher currents. The temperature monitoring function provides real-time thermal data that is used by the internal protection circuits to prevent device damage under fault conditions.

The output stage features optimized gate drive characteristics to minimize switching losses while maintaining good EMI performance. The overload protection circuitry responds quickly to overcurrent conditions, typically within microseconds, to protect both the device and the load.

Recommended Operating Conditions

• Supply Voltage Range: 8V to 36V
• Logic Supply Voltage Range: 3.3V to 5.5V
• Operating Temperature Range: -40°C to +125°C
• Output Current: 0A to 5A continuous
• Gate Drive Voltage: 4.5V minimum for full R_DS(on) performance

Design Considerations

PCB Layout Recommendations

• Use a low-impedance ground plane for optimal thermal and electrical performance
• Ensure adequate copper area for the exposed pad (minimum 20mm²)
• Keep high-current paths as short and wide as possible
• Place decoupling capacitors close to both V_DD and V_LOGIC pins

Thermal Management

• Use thermal vias under the exposed pad to transfer heat to inner layers or bottom side
• Consider using thermal interface material for high-power applications
• Monitor junction temperature using the integrated temperature sensing feature