BD682

BD682 PNP Power Transistor Technical Summary

Overview

The BD682 is a silicon epitaxial-base PNP power transistor designed for general-purpose amplifier and switching applications. This robust component is part of the BD68x series, which includes complementary NPN types (BD677, BD677A, BD679, BD679A, BD681). The BD682 offers high current capability, low saturation voltage, and excellent thermal stability, making it suitable for demanding power control applications.

Manufactured using advanced epitaxial planar technology, the BD682 provides reliable performance across industrial temperature ranges. Its construction features a large die size and optimized packaging to handle significant power dissipation while maintaining long-term reliability.

Key Features

• High collector current rating: IC = 4A (continuous)
• Collector-emitter voltage: VCEO = -100V
• Excellent DC current gain characteristics: hFE = 40-250
• Low collector-emitter saturation voltage: VCE(sat) = -0.5V (typical) at IC = -2A
• High power dissipation: 40W (at Tc=25°C)
• Complementary NPN types available (BD681 series)
• Designed for linear and switching applications
• Epitaxial planar construction for improved reliability
• Pb-free and RoHS compliant versions available

Applications

The BD682 finds use in a wide range of power electronics applications including:

• Power amplifiers and audio output stages
• Motor control circuits
• Relay drivers and solenoid controls
• Switching regulators and power supplies
• DC-DC converters
• General purpose switching applications
• Linear voltage regulators
• Industrial control systems

Electrical Characteristics (Ta=25°C unless specified)

Absolute Maximum Ratings

• Collector-Emitter Voltage (VCEO): -100V
• Collector-Base Voltage (VCBO): -100V
• Emitter-Base Voltage (VEBO): -5V
• Collector Current (IC): -4A (continuous)
• Base Current (IB): -1A
• Total Power Dissipation (Ptot): 40W (at Tc=25°C)
• Junction Temperature (Tj): 150°C
• Storage Temperature Range (Tstg): -55°C to +150°C

Thermal Characteristics

• Thermal Resistance, Junction to Case (Rthj-c): 3.125°C/W
• Thermal Resistance, Junction to Ambient (Rthj-a): 62.5°C/W

DC Current Gain Characteristics

• Current Gain (hFE):
  • 40-140 @ IC=-0.5A, VCE=-2V
  • 60-250 @ IC=-2A, VCE=-2V
• Collector-Emitter Saturation Voltage (VCE(sat)):
  • -0.5V (max) @ IC=-2A, IB=-0.4A
• Base-Emitter Saturation Voltage (VBE(sat)):
  • -1.2V (max) @ IC=-2A, IB=-0.4A

Switching Characteristics

• Turn-on Time (ton): 0.5μs (typical)
• Turn-off Time (toff): 1.5μs (typical)
• Storage Time (tstg): 1.0μs (typical)

Package Information

The BD682 is available in a TO-126 package, which provides excellent thermal performance and mechanical strength. The package features:

• Compact footprint with three leads
• Metal tab for heatsinking
• Flame retardant epoxy molding compound (UL 94 V-0 rating)
• Moisture Sensitivity Level (MSL): MSL1 (unlimited floor life)
• Lead finish: Matte tin (Pb-free option available)

Package Dimensions (TO-126)

• Total length: 10.4mm (max)
• Body width: 8.6mm (max)
• Body height: 3.6mm (max)
• Lead length: 12.7mm (nominal)
• Lead spacing: 5.4mm (between centers)

Reliability and Qualification

The BD682 meets or exceeds industry standards for reliability and performance:

• JEDEC JESD22 qualification standards
• ESD protection: Class 1 (Human Body Model)
• Flammability rating: UL 94 V-0
• RoHS compliant versions available
• Halogen-free options available upon request

Recommended Operating Conditions

For optimal performance and reliability, operate the BD682 within these parameters:

• Operating junction temperature range: -55°C to +150°C
• Recommended collector current: ≤3A for continuous operation
• Base current should not exceed 1A
• Proper heatsinking required for power dissipation >1W
• Derate power dissipation above 25°C case temperature

Handling and Mounting Considerations

• Use proper ESD precautions during handling
• Recommended soldering conditions:
  • Wave soldering: 260°C for 10 seconds maximum
  • Hand soldering: 350°C for 3 seconds maximum
• Apply thermal compound between package and heatsink
• Ensure proper lead bending (minimum 3mm from package body)

Alternative and Complementary Devices

• Complementary NPN: BD681 series
• Higher current alternatives: BDX34 series
• Lower voltage alternatives: BD140 series
• Surface mount alternatives: SOT-223 packaged equivalents